BERGQUIST GAP PAD TGP 7000ULM
功能与优点
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet size - 8" x 8" Standard Thicknesses - 0,04, 0.06, 0.08, 0.1, 0.125 inch
- Thermal Conductivity: 7 W/m-K
- High-compliance, low compression stress
- Ultra low modulus
文件和下载
技术信息
| Flame Rating | V-0 |
| Standard Thickness | 1.02 - 3.18 mm |
| Usage Temperature | -60 - 200 °C |
| 技术 | 硅 |
| 颜色 | 灰色 |